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https://hdl.handle.net/1822/5939
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Campo DC | Valor | Idioma |
---|---|---|
dc.contributor.author | Mendes, P. M. | - |
dc.contributor.author | Polyakov, A. | - |
dc.contributor.author | Bartek, M. | - |
dc.contributor.author | Burghartz, J. N. | - |
dc.contributor.author | Correia, J. H. | - |
dc.date.accessioned | 2007-01-04T11:53:57Z | - |
dc.date.available | 2007-01-04T11:53:57Z | - |
dc.date.issued | 2006-01 | - |
dc.identifier.citation | "Sensors and actuators A physical". ISSN 0924-4247. 125:2 (Jan. 2006) 217-222. | eng |
dc.identifier.issn | 0924-4247 | eng |
dc.identifier.uri | https://hdl.handle.net/1822/5939 | - |
dc.description.abstract | This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved. | eng |
dc.description.sponsorship | EU (project Blue Whale IST-2000-30006) | por |
dc.description.sponsorship | Portuguese Foundation for Science and Technology (FEDER, POCTI/ESE/38468/2001 and SFRH/BD/4717/2001) | por |
dc.language.iso | eng | eng |
dc.publisher | Elsevier 1 | eng |
dc.rights | openAccess | eng |
dc.subject | Chip-size antenna | eng |
dc.subject | Wireless microsystem | eng |
dc.subject | Wafer-level packaging | eng |
dc.subject | Excimer laser ablation | eng |
dc.subject | Via fabrication | eng |
dc.subject | water-level packaging | por |
dc.subject | wireless inicrosystein | por |
dc.title | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations | eng |
dc.type | article | por |
dc.peerreviewed | yes | eng |
dc.relation.publisherversion | http://www.sciencedirect.com/science?_ob=MImg&_imagekey=B6THG-4H5DY92-2-N&_cdi=5282&_user=2459786&_orig=browse&_coverDate=01%2F10%2F2006&_sk=998749997&view=c&wchp=dGLzVlz-zSkWz&md5=dca8e5efa46176e12057c3da92f80c97&ie=/sdarticle.pdf | eng |
sdum.number | 2 | eng |
sdum.pagination | 217-222 | eng |
sdum.publicationstatus | published | eng |
sdum.volume | 125 | eng |
oaire.citationStartPage | 217 | por |
oaire.citationEndPage | 222 | por |
oaire.citationIssue | 2 | por |
oaire.citationVolume | 125 | por |
dc.identifier.doi | 10.1016/j.sna.2005.07.016 | por |
dc.subject.wos | Science & Technology | por |
sdum.journal | Sensors and Actuators A: Physical | por |
Aparece nas coleções: | DEI - Artigos em revistas internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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17238797.pdf | 428,3 kB | Adobe PDF | Ver/Abrir |