Implementation of six sigma methodology for the elimination of contamination in Fine Pitch connectors

Abstract

Quality drives companies to evolve, providing what customers need or even exceeding their expectations through products and services that play their functions properly during their lifetime. From this perspective, this study aims to solve a concrete defect that occurs during the assembly process of an electronic product for the automotive industry. One of the new challenges in the electronics industry is the contamination issue in Printed Circuit Boards (PCB). Contamination can be defined as any type of particles (residues) that are deposited on PCB surface or within a component, causing unwanted behaviours in the electronic device. In the present study, the investigated contamination is organic in nature and is originated by the solder flux. The solder flux is released during the welding process, being deposited inside the PCB Fine Pitch connectors. The DMAIC method was adopted as a Problem Solving tool. This method was selected to ensure the elimination of this type of defect. To support the investigation, the 5W2H and Is/Is Not quality tools were used. The investigation was developed by a multidisciplinary team. After the root-cause identification, the connectors provider was involved to assist in the development of an effective and low cost solution. The final solution resulted in the placement in the connectors of a protective cap. This solution, besides protecting the connectors, allowed a new collaborative relationship along the supply chain.