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https://hdl.handle.net/1822/1950
Título: | Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages |
Autor(es): | Polyakov, A. Mendes, P. M. Sinaga, S. M. Bartek, M. Rejaei, B. Correia, J. H. Burghartz, J. N. |
Palavras-chave: | Wafer level packaging Wafer bonding Glass wafer processing |
Data: | Mai-2003 |
Editora: | IEEE |
Revista: | Proceedings - Electronic Components and Technology Conference |
Citação: | ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 53, New Orleans, 2003 - "Proceedings". New Orleans : IEEE, 2003. ISBN 0-7803-7430-4. p. 875-880. |
Resumo(s): | Various types of glass substrates have been compared with respect to their suitability as a low-loss substrate in wafer-level chip-scale packaging for RF applications. Processability has been evaluated by fabrication of shallow and deep recesses using wet etching in HF (/H3PO4) solutions. Electrical characteristics (dielectric constant and attenuation) have been extracted from measurements on coplanar wave guides (CPWs) up to 10 GHz. Results show that Coming Pyrex #7740 glass provides optical quality of wet-etched deep recesses, but exhibit about 2 times higher electrical attenuation than Hoya SD-2. Pyrex #7740 and SD-2 are thermally matched to silicon and due to some alkali content, they are suitable for anodic bonding. The relatively high content of AL2O3 (~20%) in SD-2 is favorable for its electrical properties, but makes wet etching of deep recesses more difficult. The non-alkaline AF45, with CTE almost 2 times of Si (CTEAF45=4.5x10-6 k-1), is suitable for adhesive bonding and is difficult to pattern using wet etching. Its electrical attenuation is close to that of SD-2. The measured dielectric constants (at 6 GHz) for SD-2, Pyrex #7740 and AF45 are 4.7,5.9 and 6.1, respectively. |
Tipo: | Artigo em ata de conferência |
URI: | https://hdl.handle.net/1822/1950 |
ISBN: | 0-7803-7430-4 |
ISSN: | 0569-5503 |
Arbitragem científica: | yes |
Acesso: | Acesso aberto |
Aparece nas coleções: | DEI - Artigos em atas de congressos internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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ECTC_Polyakov.pdf | 498,44 kB | Adobe PDF | Ver/Abrir |