Utilize este identificador para referenciar este registo: https://hdl.handle.net/1822/1608

Registo completo
Campo DCValorIdioma
dc.contributor.authorMendes, P. M.-
dc.contributor.authorBartek, M.-
dc.contributor.authorBurghartz, J. N.-
dc.contributor.authorCorreia, J. H.-
dc.date.accessioned2005-05-16T16:11:39Z-
dc.date.available2005-05-16T16:11:39Z-
dc.date.issued2003-06-
dc.identifier.citationIEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION, Columbus, 2003 - "Proceedings". Piscataway: IEEE, 2003. ISBN 0-7803-7846-6. vol. 2, p. 667-670.eng
dc.identifier.isbn0-7803-7846-6-
dc.identifier.issn0272-4693por
dc.identifier.urihttps://hdl.handle.net/1822/1608-
dc.description.abstractWe report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows on-chip integration and is the main issue of our work. A short-range wireless link between two systems both equipped with a 11.7x12.4 mm2 patch antenna (measured characteristics: 6 GHz central frequency, 100 MHz bandwidth @ -10 dB, 3 dB gain, 51% efficiency) realized on a Corning Pyrex #7740 glass substrate is demonstrated.eng
dc.description.sponsorshipFundação para a Ciência e Tecnologia (FCT), project (SFRH/BD/4717/2001 and POCTI/ESE/38468/2001)por
dc.language.isoengeng
dc.publisherIEEEeng
dc.rightsopenAccesseng
dc.subjectChip size antennaeng
dc.subjectAntenna on glasseng
dc.subjectAntenna integrationeng
dc.subjectWireless microsystemeng
dc.titleDesign and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystemseng
dc.typeconferencePapereng
dc.peerreviewedyeseng
oaire.citationStartPage667por
oaire.citationEndPage670por
oaire.citationVolume2por
sdum.journalIEEE Antennas and Propagation Society, Ap-S International Symposium (digest)por
Aparece nas coleções:DEI - Artigos em atas de congressos internacionais

Ficheiros deste registo:
Ficheiro Descrição TamanhoFormato 
AP_Columbus.pdf397,24 kBAdobe PDFVer/Abrir

Partilhe no FacebookPartilhe no TwitterPartilhe no DeliciousPartilhe no LinkedInPartilhe no DiggAdicionar ao Google BookmarksPartilhe no MySpacePartilhe no Orkut
Exporte no formato BibTex mendeley Exporte no formato Endnote Adicione ao seu ORCID