Utilize este identificador para referenciar este registo:
https://hdl.handle.net/1822/1567
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Campo DC | Valor | Idioma |
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dc.contributor.author | Mendes, P. M. | - |
dc.contributor.author | Polyakov, A. | - |
dc.contributor.author | Bartek, M. | - |
dc.contributor.author | Burghartz, J. N. | - |
dc.contributor.author | Correia, J. H. | - |
dc.date.accessioned | 2005-05-12T15:11:18Z | - |
dc.date.available | 2005-05-12T15:11:18Z | - |
dc.date.issued | 2003-06 | - |
dc.identifier.citation | TRANSDUCERS ´03. IEEE INTERNATIONAL CONFERENCE ON SOLID STATE SENSORS, ACTUATORS AND MICROSYSTEMS, 12, Boston, 2003 - "Digest of technical papers". Boston : IEEE, 2003. ISBN 0-7803-7731-1. vol. 1. p. 49-52. | eng |
dc.identifier.isbn | 0-7803-7731-1 | - |
dc.identifier.uri | https://hdl.handle.net/1822/1567 | - |
dc.description.abstract | We report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8x8 mm2 patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18% efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5x4x1 mm3 and has a projected efficiency of 60%. | eng |
dc.description.sponsorship | Fundação para a Ciência e Tecnologia (FCT), project (SFRH/BD/4717/2001 and POCTI/ESE/38468/2001). | eng |
dc.language.iso | eng | eng |
dc.publisher | IEEE | eng |
dc.rights | openAccess | eng |
dc.subject | Integrated antenna | eng |
dc.subject | Wireless sensor networks | eng |
dc.subject | Wafer level packaging | eng |
dc.subject | Antenna measurements | por |
dc.subject | Bandwidth | por |
dc.subject | Chip scale packaging | por |
dc.subject | Fabrication | por |
dc.subject | Frequency measurement | por |
dc.subject | Gain measurement | por |
dc.subject | Patch antennas | por |
dc.subject | Wafer bonding | por |
dc.subject | Wafer scale integration | por |
dc.title | Integrated 5.7 GHz chip-size antenna for wireless sensor networks | eng |
dc.type | conferencePaper | eng |
dc.peerreviewed | yes | eng |
oaire.citationStartPage | 49 | por |
oaire.citationEndPage | 52 | por |
oaire.citationVolume | 1 | por |
dc.identifier.doi | 10.1109/SENSOR.2003.1215250 | por |
sdum.conferencePublication | TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers | por |
Aparece nas coleções: | DEI - Artigos em atas de congressos internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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Transducers.pdf | 269,26 kB | Adobe PDF | Ver/Abrir |